Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Patent
1997-07-28
1999-10-26
Kopec, Mark
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
510176, 510178, 510181, 510182, 510201, 510204, 510245, 510253, 510254, 510256, 510259, 510263, 510504, 510510, 134 12, 134 13, 134 3, 483905, 483906, 483974, C11D 162, C11D 708, C11D 344
Patent
active
059728620
ABSTRACT:
There is disclosed a cleaning liquid for producing a semiconductor device which comprises (A) fluorine-containing compound; (B) water-soluble or water-miscible organic solvent; and (C) inorganic acid and/or organic acid, optionally, further comprises (D) quaternary ammonium salt or (D') a specific organic carboxylic acid ammonium salt and/or an organic carboxylic acid amine salt; as well as a process for producing a semiconductor device by forming a resist pattern on a substrate equipped on the surface with an insulating film layer or a metallic electroconductive layer, forming a via hole or electric wiring by dry etching, removing the resist pattern by ashing treatment with oxygen plasma; and effecting an cleaning treatment with the above cleaning liquid. The above cleaning liquid and production process can readily remove the deposit polymer formed in the case of dry etching without impairing metallic film and insulating film.
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Aoyama Tetsuo
Gotoh Hideto
Hara Kazusato
Hasemi Ryuji
Ikeda Hidetoshi
Boyer Charles
Kopec Mark
Mitsubishi Gas Chemical
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