Measuring and testing – Surface and cutting edge testing
Reexamination Certificate
2007-01-02
2007-01-02
Larkin, Daniel S. (Department: 2856)
Measuring and testing
Surface and cutting edge testing
C438S014000
Reexamination Certificate
active
10932083
ABSTRACT:
The present invention relates to a cleaning evaluation method for evaluating a surface cleanliness of a substrate which has been cleaned after being polished. This method includes preparing a dummy substrate having a metal film formed on a surface thereof and a monitor substrate on which a cleaning evaluation is performed, and polishing the dummy substrate. After polishing the dummy substrate, the monitor substrate is polished without dressing a polishing surface of a polishing table, the monitor substrate is cleaned, and the surface cleanliness of the monitor substrate which has been cleaned is evaluated.
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Ariga Yoshikazu
Nishioka Yukiko
Ebara Corporation
Larkin Daniel S.
Wenderoth , Lind & Ponack, L.L.P.
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