Cleaning compositions for removing etching residue with hydroxyl

Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...

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510176, 510405, 510499, 510401, 510402, 510108, 510245, 510254, 510434, 510489, 510492, 510505, C11D 726, C11D 732, C11D 734, C11D 750

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active

056725779

ABSTRACT:
A stripping and cleaning composition for removing resists and etching residue from substrates containing hydroxylamine and at least one alkanolamine is described. Further, a cleaning composition for removing etching residue from semiconductor substrates containing hydroxylamine, at least one alkanolamine, at least one chelating agent, and water is described. The preferred chelating agent is 1,2-dihydroxybenzene or a derivative thereof. The chelating agent provides added stability and effectiveness to the cleaning composition.

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Material Safety Data Sheet, Experimental Stripper, WMX-225 (1 sheet).
Material Safety Data Sheet, Experimental Stripper, WMX-230 (1 sheet).

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