Cleaning compositions and methods for removing soldering flux

Cleaning and liquid contact with solids – Processes – Oils – grease – tar – or wax removal – by dissolving

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134 42, 252170, 252171, B08B 308, C23G 5024, C11D 318, C11D 320

Patent

active

049832247

ABSTRACT:
A method to remove solder flux residues from assembled or partially assembled electronic circuit boards employs a composition containing a nonpolar component consisting essentially of terpenes and/or terpenols, a polar component consisting essentially of a polar aprotic solvent or a mixture of polar aprotic solvents, and a surfactant. Use of this composition results in shorter cleaning times at lower temperatures with superior results.

REFERENCES:
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patent: 4640719 (1987-02-01), Hayes et al.
patent: 4740247 (1988-04-01), Hayes et al.
patent: 4867800 (1989-09-01), Dishart et al.
"The Printed Circuit Handbook", Koombs, C. F. Editor., pp. 16-2 to 16-13.
Barnier, Kester Solder Company, "Flux and Solder Controls for High Speed Printed Circuit Board Soldering", Litton Systems, Chicago, Ill.
Barnier, Kester Solder Company Publication, "Activation Temperature for Fluexs", Litton Systems, Chicago, Ill.
Barnier, Kester Solder Company, "The Advantages in Using Bi-Polar Solvents un the Removal of Resin Fluxes", Litton Systems, Chicago, Ill.
Barnier, Kester Solder Company, "Residues? Solvents? and Other Questions about Vapor Degreasing of PC Boards", Litton Systems, Chicago, Ill.
Barnier, Kester Solder Company, "Removing Organic Flux Residue", Litton Systems, Chicago, Ill.
Barnier, Kester Solder Company, "Soldering Fluxes", Litton Systems, Chicago, Ill.
Casperson, Zenith Radio Corporation Publication, "The Nature of Residues Being Presented to the Cleaning Machine", Glenview, Ill.
Liyanage, PC FAB, (Oct. 1987), pp. 61-69.
Slepping, PC FAB, (Dec. 1987), pp. 56-57.
Truck, Circuits Manufacturing, (Aug. 1988), pp. 48-52.
Woodgate, Electronic Packaging and Production (Jan. 1988), pp. 109-110.

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