Cleaning composition for mold for molding semiconductor device a

Details Cleaning composition for mold for molding semiconductor device a Cleaning composition for mold for molding semiconductor device a

1997-07-02

1999-07-20

Hertzog, Ardith

Cleaning compositions for solid surfaces, auxiliary compositions

Cleaning compositions or processes of preparing

For cleaning a specific substrate or removing a specific...

510438, 510445, 510455, 510500, C11D 1704, C11D 337, C11D 1700

Patent

active

059256052

ABSTRACT:
A cleaning composition for a mold for molding a semiconductor device comprising an unvulcanized rubber, a cleaning agent, and water in an amount of from 1 to 30% by weight based on the total amount of the cleaning composition.
The cleaning composition is preferably used as a sheet form comprising the cleaning composition itself, wherein a plurality of straight cuts are formed on the surface of the sheet in a definite direction in parallel at an definite interval for enabling folding of the sheet and at least one cutting cut may be formed on the surface such that the cutting cut crosses perpendicularly to the plural cuts.
The cleaning sheet is very effective to remove soiled material on the inside surfaces of a mold formed by repeatedly molding semiconductor devices using a thermosetting resin composition.

REFERENCES:
patent: 1929560 (1933-10-01), Morton
patent: 3476599 (1969-11-01), Grover et al.
patent: 4670329 (1987-06-01), Pas
patent: 4935175 (1990-06-01), Kitaura et al.
patent: 4956132 (1990-09-01), Kitaura et al.
patent: 5468422 (1995-11-01), Khouzam et al.
patent: 5556572 (1996-09-01), Nishinaka et al.
EP Search Report, dated Sep. 18, 1997, for EP 97110511.9.

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