Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...
Patent
1998-06-15
2000-04-04
Utech, Benjamin L.
Cleaning and liquid contact with solids
Processes
Including application of electrical radiant or wave energy...
252 793, 252 794, 216 89, 216 97, 438692, 438750, 510176, C09K 1308, C09K 1306, C11D 904, B08B 600, H01L 21302
Patent
active
060448512
ABSTRACT:
A composition prepared from water, hydrofluoric acid (HF) and tetraalkylammonium hydroxide (TAAH, preferably tetramethylammonium hydroxide (TMAH)) or tetraalkylammonium fluoride and solvent with or without HF or TAAH is used to clean residue from a semiconductor wafer, where the residue is formed as a result of a planarization process, such as chemical mechanical polishing. Incorporation of TMAH into an aqueous HF composition retards the rate at which the composition dissolves borophosphosilicate (BPSG) without effecting the rate at which silica is dissolved. Thus, the aqueous HF/TMAH composition may be used to completely remove silica-containing residue from a BPSG surface, with a tolerable level of BPSG removal.
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Andreas Michael T.
Grieger Eric K.
Walker Michael A.
Goudreau George
Micro)n Technology, Inc.
Utech Benjamin L.
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