Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Reexamination Certificate
2006-07-18
2006-07-18
Del Cotto, Gregory R. (Department: 1751)
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
C510S245000, C510S255000, C510S258000, C510S264000, C510S499000, C510S502000, C510S259000, C510S504000
Reexamination Certificate
active
07078371
ABSTRACT:
The cleaning composition of the present invention is characterized by containing N-hydroxyformamide. The cleaning composition is capable of easily removing patterned photoresist masks or resist residues remaining on substrates after the etching process or removing resist residues remaining after the etching process and the subsequent ashing process within a short period of time without causing the corrosion of wiring materials and insulating films, thereby ensuring the fine processing to provide high-precision wiring circuits.
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patent: 2002/0177316 (2002-11-01), Miller et al.
patent: 2003/0078174 (2003-04-01), Park et al.
patent: 2004/0152309 (2004-08-01), Carter et al.
patent: WO99/23667 (1999-05-01), None
Del Cotto Gregory R.
Mitsubishi Gas Chemical Company Inc.
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