Cleaning and liquid contact with solids – Processes – Using sequentially applied treating agents
Reexamination Certificate
2008-02-12
2008-09-23
Stinson, Frankie L (Department: 1792)
Cleaning and liquid contact with solids
Processes
Using sequentially applied treating agents
C134S06400P, C134S076000
Reexamination Certificate
active
07427330
ABSTRACT:
Described are cleaning benches and methods for removing contaminant layers from semiconductor process components using small volumes of hazardous liquids and minimizing cross-contamination between components from different deposition chambers. Components to be cleaned are stored within or supported by a dedicated cassette before they are placed in a receptacle of cleaning liquid. The cassette displaces a significant percentage of the receptacle's volume; consequently, only a relatively small volume of cleaning liquid is needed to fully submerge the component. In typical embodiments, the combined cassette and component displace a volume of liquid that is greater than the volume of liquid used to clean the component. The cleaning bench can include different chemical baths for different components. Cassettes dedicated for use with particular components can be keyed to particular receptacles.
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Zuck David S.
Zuck Dwight J.
Behiel Arthur J.
Quantum Global Technologies, LLC
Silicon Edge Law Group LLP
Stinson Frankie L
LandOfFree
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