Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Contacting coating as it forms with solid member or material...
Reexamination Certificate
2005-05-17
2005-05-17
Koehler, Robert R. (Department: 1775)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Contacting coating as it forms with solid member or material...
C205S705000, C205S709000, C205S722000, C205S723000, C015S300100, C134S021000
Reexamination Certificate
active
06893549
ABSTRACT:
A cleaning apparatus for an ECMD anode pad including a vacuum head which applies vacuum pressure to the surface of the anode pad between ECMD operations in order to remove particles precipitated onto the surface of the anode pad and prevent or minimize inadvertent scratching or peeling of a wafer supported by the pad during the process. The particles are dislodged from the anode pad and removed from the ECMD system by flow of electrolyte solution into the vacuum head. The electrolyte solution is typically filtered before returning to the electrolyte tank for ultimate redistribution to the ECMD system.
REFERENCES:
patent: 3874022 (1975-04-01), Wogoman et al.
Chou Shih-Wei
Tsai Minghsng
Koehler Robert R.
Taiwan Semiconductor Manufacturing Co. Ltd
Tung & Associates
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