Cleaning and liquid contact with solids – Apparatus – With plural means for supplying or applying different fluids...
Reexamination Certificate
2011-08-23
2011-08-23
Kornakov, Michael (Department: 1714)
Cleaning and liquid contact with solids
Apparatus
With plural means for supplying or applying different fluids...
C134S099100, C134S102100, C134S199000, C134S200000
Reexamination Certificate
active
08001983
ABSTRACT:
A wafer W is held in a horizontal attitude within an airtight container41by a vacuum chuck42such that small gaps are formed between the wafer W and the inner surfaces of the airtight container41. A cleaning liquid is supplied toward the center portion of a front surface of the wafer W through a fluid supply port40which is an end of a fluid supply path5, and is discharged through a fluid discharge portion44arranged in the bottom portion of the airtight container41in a form of a groove running along a circle having its center located on the center axis of the wafer W. The cleaning liquid flows and spreads from the center portion of the wafer W toward the peripheral portion while removing particles adhered to the wafer W, and is discharged through the fluid discharge portion44.This arrangement allows the particles to be uniformly and reliably removed without rotating the wafer W. The entire cleaning apparatus4has a small size.
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Fukuda Masahiro
Yamamoto Taro
Campbell Natasha
Kornakov Michael
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Tokyo Electron Limited
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