Cleaning apparatus and cleaning method for wafer

Details Cleaning apparatus and cleaning method for wafer Cleaning apparatus and cleaning method for wafer

2011-03-22

2011-03-22

Karls, Shay L (Department: 3723)

Brushing, scrubbing, and general cleaning

Machines

Brushing

C015S088300, C015S088200

Reexamination Certificate

active

07908698

ABSTRACT:
A wafer on which a CMP processing is completed is rotated. A front surface cleaning brush and a rear surface cleaning brush are made contact both surfaces of the wafer while being rotated. After the front surface cleaning brush and the rear surface cleaning brush are made to contact the wafer, both end portions of the front surface cleaning brush and the rear surface cleaning brush are deformed by means of pressurizing both ends of the front surface cleaning brush and the rear surface cleaning brush by pressure portions. That is, the both end portions of the front surface cleaning brush and the rear surface cleaning brush are compressed to enlarge diameters in the both end portions. As a consequence, the entire front surface of the wafer is made to contact the front surface cleaning brush substantially evenly, even if the wafer is warped into a shape of a mound. Therefore, a cleaning efficiency of the outer peripheral portion of the wafer improves.

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“Japanese Office Action”, mailed by JPO and corresponding to Japanese application No. 2006-008323 on Apr. 20, 2010.
Japanese Office Action, Partial English Translation, mailed Dec. 21, 2010 for corresponding Japanese Application No. 2006-008323.

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