Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...
Reexamination Certificate
2005-01-04
2005-01-04
Barr, Michael (Department: 1746)
Cleaning and liquid contact with solids
Processes
For metallic, siliceous, or calcareous basework, including...
C134S006000, C134S034000, C134S036000, C134S042000, C510S175000, C205S205000, C015S077000, C015S102000
Reexamination Certificate
active
06837941
ABSTRACT:
A cleaning apparatus of an electronic component of the present invention comprises: means for supplying cleaning water to an object to be cleaned such as alumina titanium carbide wafer, a sponge member for contacting with the object to be cleaned to clean a surface thereof, means for moving the object to be cleaned and the sponge member relative to each other, and means for adjusting the resistivity value of the cleaning water to 10MΩ or less. Using this apparatus, the object to be cleaned is cleaned using the sponge member while supplying, to the object to be cleaned, cleaning water having the resistivity value of 10MΩ or less. In this case, the cleaning degree is enhanced by soaking the object to be cleaned in the water having the resistivity value of 10MΩ or less before cleaning, and by using a dummy substrate.
REFERENCES:
patent: 3898351 (1975-08-01), Kennison et al.
patent: 5336371 (1994-08-01), Chung et al.
patent: 5516730 (1996-05-01), Pirooz et al.
patent: 5693148 (1997-12-01), Simmons et al.
patent: 5712198 (1998-01-01), Shive et al.
patent: 5723019 (1998-03-01), Krusell et al.
patent: 5741403 (1998-04-01), Tenhover et al.
patent: 5845660 (1998-12-01), Shindo et al.
patent: 5873380 (1999-02-01), Kanno
patent: 6001191 (1999-12-01), Kamikawa et al.
patent: 6146469 (2000-11-01), Toshima
patent: 6167583 (2001-01-01), Miyashita et al.
patent: 403131026 (1991-06-01), None
patent: 404206724 (1992-07-01), None
patent: 410064872 (1998-03-01), None
Kern, W., Handbook of Semiconductor Wafer Cleaning Technology, “Science, Technology, and Applications”, pp. 76-81 (1993).
Hirooka Taisuke
Sakumichi Hidetaka
Armstrong Kratz Quintos Hanson & Brooks, LLP
Barr Michael
Neomax Co. Ltd.
Winter Gentle E.
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