Cleaning and drying method and apparatus

Cleaning and liquid contact with solids – Apparatus – Sequential work treating receptacles or stations with means...

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Details

134140, 134143, 134200, 134902, B08B 304

Patent

active

061584495

ABSTRACT:
An enclosure 23A that defines a drying chamber 23 is configured of a pair of enclosing elements 23c and 23d and a base element 23b. When wafers enter or leave the drying chamber 23, the enclosing elements 23c and 23d are lifted upward by vertical air cylinders 42 to separate them from the base element 23b. The enclosing elements 23c and 23d are then moved in directions that mutually separate them. To dry wafers within the drying chamber 23, the enclosing elements and the base element 23b are mutually engaged to form a hermetic seal, in the opposite sequence.
The present invention reduces the dimensions of the drying chamber without impeding the work of moving wafers into and out of the drying chamber. This makes it possible to reduce the internal volume of the drying chamber, achieving a reduction is the consumption of drying gas, an improvement in the drying efficiency, and a reduction in overall size of the apparatus.

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patent: 5569330 (1996-10-01), Schild et al.
patent: 5657553 (1997-08-01), Tarui et al.

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