Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Patent
1993-07-14
1995-02-07
Valentine, Donald R.
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
205164, 205166, C25D 556
Patent
active
053873327
ABSTRACT:
A method for the direct metallization of non-conductors and printed circuit boards is disclosed wherein the non-conductive substrate or printed circuit board is treated with an aqueous cleaner/conditioner composition comprising a cationic surfactant, said surfactant is a quaternary ammonium ion having a molecular weight of below 1,000, thereby rendering the substrate of a printed circuit board receptive to the uniform adherence and adsorption of the noble metal catalyst deposited thereafter, which catalysts are used, directly or indirectly, as the sites of direct electroplating without the need of using electroless plating. The cleaner/conditioner is particularly useful because it does not require the use of chelating agent(s) which are commonly used in the art and thereby eliminates waste treatment problems prevalent in the industry.
REFERENCES:
patent: 4683036 (1987-07-01), Morrissey et al.
patent: 4687552 (1987-08-01), Early et al.
patent: 4891069 (1990-01-01), Holtzman et al.
patent: 4969979 (1990-11-01), Appelt et al.
patent: 5071517 (1991-12-01), Oabayashi
Leader William T.
Valentine Donald R.
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