Electric heating – Metal heating – By arc
Patent
1994-05-26
1996-07-23
Walberg, Teresa J.
Electric heating
Metal heating
By arc
21912184, 29847, B23K 2616
Patent
active
055391745
ABSTRACT:
A laser is used to cut or "zap" unwanted sections of an aluminum interconnect metallization pattern on a microelectronic circuit substrate. Vaporized aluminum forms a cloud above the substrate that is reacted with a gas to form a substance which can be prevented from solidifying and forming a conductive residue on the substrate that could create a short circuit in the metallization pattern. The gas can be pressurized oxygen, in which case the reactant substance is electrically insulative aluminum oxide that forms a desirable sealing coating over the cut area. The aluminum oxide has a lower density than aluminum, and expands in the cut area to form a hermetic seal with the facing edges of the metallization pattern. Alternatively, the gas can be chlorine or other material which forms a residue that can be easily removed using a solvent such as water.
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Janal, Meir, "Technologies for Economic Production of ASICs", Mar. 1993 Solid State Technology at pp. 35, 36, 38.
Pasch Nicholas F.
Rostoker Michael D.
LSI Logic Corporation
Mills Gregory L.
Walberg Teresa J.
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