Clamshell apparatus with crystal shielding and in-situ...

Chemistry: electrical and wave energy – Apparatus – Electrolytic

Reexamination Certificate

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C204S212000, C204S242000, C204S275100

Reexamination Certificate

active

07033465

ABSTRACT:
Certain mechanisms of a plating apparatus address problems associated with interaction between plating solutions or other processing solutions and the components of the plating apparatus (such as the electrical contacts). For example, a circumferential spray skirt around the interface of a “cup” and “cone” in the plating apparatus protects these features during plating. A shield mechanism contacts the cup and/or cone at the periphery of their interface to provide a fluid resistant seal. In some cases, the cone includes an outer circumferential lip that engages a complementary surface of the cup for this purpose. Further, a mechanism is provided for raising and lowering the work piece with the cone in order to allow in situ rinsing of the work piece and/or regions of the cup.

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Shin-Etsu Polymer Co., Ltd., “L-Type Connector,” http://www.shinpoly.co.jp/business/connector/products—e/l.html?typezeb (1 page), no date.
Shin-Etsu Polymer Co., Ltd., “SS-Type Connector,” http://www.shinpoly.co.jp/business/connector/products—e/ss.html?typezeb (2 pages), no date.

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