Clamshell apparatus for electrochemically treating semiconductor

Details Clamshell apparatus for electrochemically treating semiconductor Clamshell apparatus for electrochemically treating semiconductor

1997-11-13

2000-12-05

Gorgos, Kathryn

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204297R, C25D 1700

Patent

active

061561673

ABSTRACT:
An apparatus for electroplating a wafer surface includes a cup having a central aperture defined by an inner perimeter, a compliant seal adjacent the inner perimeter, contacts adjacent the compliant seal and a cone attached to a rotatable spindle. The compliant seal forms a seal with the perimeter region of the wafer surface preventing plating solution from contaminating the wafer edge, wafer backside and the contacts. As a further measure to prevent contamination, the region behind the compliant seal is pressurized. By rotating the wafer during electroplating, bubble entrapment on the wafer surface is prevented. Further, the contacts can be arranged into banks of contacts and the resistivity between banks can be tested to detect poor electrical connections between the contacts and the wafer surface.

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