Clampless vacuum heat transfer station

Heat exchange – With retainer for removable article

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Details

118724, F28F 700

Patent

active

055116086

ABSTRACT:
A clampless heat exchange station for a semiconductor wafer for use in a vacuum chamber, at pressures from 2 Torr to 30 Torr using commercial grade inert gas. The heat exchange chuck has apertures therethrough in the region where the wafer is to be mounted to serve as a miniature plenum gas to provide equal pressure along the bottom and top sides of the wafer. This configuration avoids chipping and particle deposition and provides improved heat transfer rate and wafer temperature uniformity.

REFERENCES:
patent: 3895967 (1975-07-01), Anthony
patent: 4457359 (1984-07-01), Holden
patent: 4909314 (1990-03-01), Lamont, Jr.
patent: 5181556 (1993-01-01), Hughes
patent: 5287914 (1994-02-01), Hughes

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