Clamping structure and heat dissipating module using same

Details Clamping structure and heat dissipating module using same Clamping structure and heat dissipating module using same

2006-05-09

2006-05-09

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C257S718000, C257S719000, C257S727000, C174S016300, C165S080300, C165S185000, C024S505000, C024S510000

Reexamination Certificate

active

07042728

ABSTRACT:
A clamping structure is used to fix a heat-dissipating body on a chip module. The clamping structure comprises a clamping body, two clamping portions, a pivot element, a top frame and a bottom frame. The two clamping portions are respectively connected to two sides of the clamping body and are clamped to the bottom frame. The pivot element is pivotally connected to the clamping body and has a movable portion and an ear piece. The ear piece has a fixed portion and a release portion respectively formed at an end side thereof for fixing and releasing the heat-dissipating body. The clamping structure is used to eliminate a spare gap between the clamping element and the top frame, and clamping element and the bottom frame without using the elastic element. The clamping structure can also be used with a heat sink to form a heat-dissipating module.

REFERENCES:
patent: 6449152 (2002-09-01), Lin
patent: 6450248 (2002-09-01), Chang
patent: 6662412 (2003-12-01), Chuang et al.
patent: 6731504 (2004-05-01), Liu
patent: 6822864 (2004-11-01), Huang et al.

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