Clamping ring design to reduce wafer sticking problem in metal d

Details Clamping ring design to reduce wafer sticking problem in metal d Clamping ring design to reduce wafer sticking problem in metal d

1999-07-12

2000-12-19

Diamond, Alan

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429802, 20429809, 118728, 118721, 118720, 118715, 118500, 118503, 269254R, 269903, C23C 1450, C23C 16458

Patent

active

061623369

ABSTRACT:
A clamping ring design that eliminates the Wafer sticking problem. In the first embodiment of the present invention the wafer clamp ring is redesigned to sharply reduce the wafer to wafer-ring contact area. In the second embodiment of the present invention a clamp ring guide is added to prolong the lifetime of the clamp ring.

REFERENCES:
patent: 5228501 (1993-07-01), Tepman et al.
patent: 5421401 (1995-06-01), Sherstinsky et al.
patent: 5460703 (1995-10-01), Nulman et al.
patent: 5467220 (1995-11-01), Xu
patent: 5484011 (1996-01-01), Tepman et al.
patent: 5725718 (1998-03-01), Banholzer et al.
patent: 5810931 (1998-09-01), Stevens et al.
patent: 5925226 (1999-07-01), Hurwitt et al.
patent: 5930661 (1999-07-01), Lu
patent: 5942041 (1999-08-01), Lo et al.
patent: 5958198 (1999-09-01), Banholzer et al.
patent: 6012509 (2000-01-01), Nonaka

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