Clamping device for processing electronic devices

Metal fusion bonding – Including means to force or clamp work portions together... – Work portion comprises electrical component

Reexamination Certificate

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Details

C228S004500

Reexamination Certificate

active

10894514

ABSTRACT:
A clamping device is provided for holding an electronic device, such as a semiconductor carrier in the form of a leadframe, during processing thereof. It includes a main body for covering the electronic device and an opening in the main body for providing access to a part of the electronic device to be worked upon. A support structure is attachable for coupling it to a periphery of the opening whereby the support structure is extended across the opening for supporting the part of the electronic device that is accessible through the opening.

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patent: 5035034 (1991-07-01), Cotney
patent: 5242103 (1993-09-01), Denvir
patent: 5611478 (1997-03-01), Asanasavest
patent: 5954842 (1999-09-01), Fogal et al.
patent: 6062459 (2000-05-01), Sabyeying
patent: 6390350 (2002-05-01), Fogal et al.
patent: 6921017 (2005-07-01), Evers et al.
patent: 2001/0007084 (2001-07-01), Koo et al.

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