Clamp profiling control method

Gear cutting – milling – or planing – Milling – With regulation of operation by templet – card – or other...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

51 2AA, 318578, 364474, 409127, 409132, B23Q 3506

Patent

active

045990220

DESCRIPTION:

BRIEF SUMMARY
DESCRIPTION

This invention relates to a clamp profiling control method and, more particularly, to a clamp profiling control method through which profiling machining can be performed with excellent efficiency.
In profiling machining, a so-called clamp profiling method is available. With clamp profiling, (a) a level (referred to as the clamp level) is preset in the direction of profiling depth, (b) a stylus profiling the shape of a model eventually arrives at the clamp level, (c) when this occurs, the profiling operation is suspended and a clamp feed is performed, thereby preventing an excess amount of cutting, and (d) thereafter, clamp profiling is performed a plurality of times by successively changing the clamp level each time the profiling along the profiling path and clamp feed occurs.
FIG. 1 is an explanatory view of clamp profiling, in which L1, L2 . . . Ln, Ln+1 denote first, second, . . . n-th, (n+1)-th clamp levels, STL represents a stylus, and MDL represent a model. In the first clamp profiling operation, the stylus STL is fed along the model to the first clamping level L1 (A1.fwdarw.B1), then is clamp fed from B1 to C1, then from C1 to D1 along the model after the clamp feed. Thereafter, the foregoing steps are repeated upon performing a pick-feed in a direction orthogonal to the plane of the paper. The first clamp profiling operation ends upon completion of a number of the pick-feed cycles. When the first clamp profiling operation is completed, the stylus is returned to point Al, the clamp level is changed to the second clamp level L2, and the stylus is transported along the path A1.fwdarw.B2.fwdarw.C2.fwdarw.D2. Thereafter, the clamp level is changed in similar fashion each time the first clamp profiling operation ends, eventually bringing the profiling work to an end.
In the prior art, as shown in FIG. 2, profiling control is performed in the following manner in a case where the profiling path starts at ST and ends at ED, along which path clamp profiling is performed at locations Hl, H2. Specifically, (a) profiling feed in the direction of the arrows and pick feed are repeated starting from the starting point ST, (b) clamp profiling is performed at each of the locations H1, H2, (c) after clamp profiling, profiling feed and pick feed are repeated up to the end point ED, (d) profiling feed is carried out again from the starting point ST, and (e) performing a clamp feed when the stylus moves below the new clamp levels at locations Hl, H2, the operation reaching the end point ED. The foregoing activity is repeated again and again. Thus, when a plurality of the locations at which the clamp feed is performed are dispersed in the profiling path, profiling according to the conventional method is performed a plurality of times even at portions other than the clamp feed locations, resulting in wasted machining time and poor efficiency.
Accordingly, the object of the present invention is to provide a novel clamp profiling control method through which profiling can be controlled with excellent efficiency even when there are clamp profiling areas in a profiling path.


SUMMARY OF THE INVENTION

A clamp profiling control method in which a profiling feed operation, a profiling starting point return operation and a pick-feed operation are performed alternately, and in which a clamp feed is performed at a set clamp level. Provided are first memory means for storing an initial position at which clamp feed is performed, second memory means at which clamp feed is no longer performed during profiling feed, and clamp level setting means capable of successively changing the clamp level. Repetitive profiling control is performed, while changing the clamp level in the clamp level setting means, between a position stored by the first memory means and a position stored by the second memory means. When the clamp feed is no longer performed even once in the course of this profiling control, the initial value of the clamp level is set in the clamp level setting means and operation advances to the next profiling region whe

REFERENCES:
patent: 4386408 (1983-05-01), Imazeki et al.
patent: 4456864 (1984-06-01), Imazeki et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Clamp profiling control method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Clamp profiling control method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Clamp profiling control method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1448950

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.