Clamp for use with electroplating apparatus and method of using

Details Clamp for use with electroplating apparatus and method of using Clamp for use with electroplating apparatus and method of using

1994-12-09

1996-12-31

Valentine, Donald R.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

205134, 204242, 204279, 204297R, 204297W, 204DIG7, 269 871, C25D 500, C25D 1706, C25D 1708

Patent

active

055890512

ABSTRACT:
A clamp for use in an electrolytic plating bath is disclosed. The clamp comprises two levers pivotally attached to each other at a fulcrum wherein the clamp, when floating on top of a liquid, is in an open position but when submerged is caused, by virtue of its buoyancy, to move to a closed position. Each lever comprises a first part integrally attached to a second part. The first part and the second part are situated on opposite sides of the fulcrum from each other such that rotational movement about the fulcrum between the open position and the closed position causes the second parts of each lever to move from an upper position to a lower position. In operation, at least one substrate is supported in a substantially vertical plane for submersion into an electrolyte bath. The substrate is positioned over the electrolyte bath and then is submersed into it. The clamp clamps the substrate at its lower edge as the substrate enters the electrolyte bath.

REFERENCES:
patent: 2101178 (1937-12-01), Hogaboom et al.
patent: 2859166 (1958-11-01), Grigger
patent: 3090823 (1963-05-01), Roach
patent: 3821097 (1974-06-01), Ettel
patent: 3862891 (1975-01-01), Smith
patent: 3939915 (1976-02-01), Wood
patent: 3970540 (1976-07-01), McBain
patent: 4085997 (1978-04-01), Hainsworth
patent: 4113586 (1978-09-01), Cook
patent: 4844779 (1989-07-01), Callahan
patent: 4879007 (1989-11-01), Wong
patent: 5152881 (1992-10-01), Sim
patent: 5391276 (1995-02-01), Astor et al.

Affiliated with

Also associated with

Rating

Clamp for use with electroplating apparatus and method of using does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Clamp for use with electroplating apparatus and method of using , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Clamp for use with electroplating apparatus and method of using will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1139401