Electrolysis: processes – compositions used therein – and methods – Electrolytic coating
Reissue Patent
1998-12-30
2001-02-13
Valentine, Donald R. (Department: 1741)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
C204S242000, C204S279000, C204S297080, C204S297080, C204SDIG007, C269S087100
Reissue Patent
active
RE037050
ABSTRACT:
This invention relates to a clamp.
In particular this invention relates to a buoyancy activated clamp.
In addition this invention relates to a cathode shield, electroplating apparatus and method using a clamping means.
Known clamps are not very
sutiable
suitable
for use in automated processes.
In U.S. Pat. No. 4,879,007 (to the same assignee, and incorporated in this specification by reference) a means for increasing the efficiency and speed of automated electroplating is described. Substrates to be electroplated are automatically clamped at the top and brought in to be suspended over an electrolyte bath. The substrates are then lowered into the bath, at which time their lower edges contact a cathode shield device floating on the top of the bath. The weight of the substrates and the pressure bearing down upon them is sufficient to overcome the buoyancy of the shield and to move it down into the electrolyte bath. Flexible substrates, however, even if they are able to bear down enough on the cathode shield to push it into the bath, tend to warp and wobble, creating an uneven pattern of electroplating on the substrate. This problem is usually over come by placing around the perimeter of flexible substrates, a rigid frame. This solution has a number of drawbacks: firstly, the substrates usually must be loaded by hand; secondly, the frame gets coated with metal as well, which metal must then be scraped off; and thirdly, in view of the above drawbacks, the electroplating process is rather slow.
The object of the present invention is to overcome the above disadvantages or difficulties or at least to provide public with a useful choice.
Accordingly, in a first embodiment this invention consists in a clamp comprising two levers pivotally attached to each other at a fulcrum wherein the clamp, when floating on top of a liquid, is in a first position but when submerged, by virtue of its buoyancy is caused to move to a second position.
In a second embodiment, the present invention consists in a method for the electrolytic deposition of a coating of metal on an electroplatable substrate as cathode in an electrolyte bath equipped with anode wherein the substrate is supported in a substantially vertical plane and is automatically clamped at its lower edge as it enters the electrolyte bath.
In a third embodiment, the present invention consists in a cathode shielding device for use in an electrolytic plating bath, said device comprising: an elongated trough adapted to be inserted in said bath; said trough being provided with a plurality of clamps comprising two levers pivotally attached to each other at a fulcrum wherein the clamp, when floating on top of a liquid, is in a first position but when submerged, by virtue of its buoyancy is caused to move to a second position; said clamps being aligned substantially in parallel vertical planes transverse to the longitudinal axis of said trough, for securing one or more electroplatable substrates in a substantially vertical plane with the lower edge of each of said substrates located below the plane in which lies the upper edges of said trough; and said trough having a plurality of perforations in the upper region of the sides thereof.
In a fourth embodiment, the present invention consists in an apparatus for electrolytic deposition of metal on a substrate comprising a container for electrolyte; a cathode bus bar; and a clamping means, wherein an electroplatable substrate is attachable at an upper edge to the cathode bus bar and the clamping means clamps lower edge of any substrate attached to the cathode bus bar as the substrate enters the container.
REFERENCES:
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Process Automation International Limited
St. Onge Steward Johnston & Reens LLC
Valentine Donald R.
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