Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1998-08-25
2000-08-22
Bueker, Richard
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
C23F 102
Patent
active
061066648
ABSTRACT:
A clamp affixes a wafer by entirely covering the edge of the wafer, wherein the radius of the inner surface of the clamp is about 1 mm shorter than the radius of the wafer. Besides, there are four pairs of square protuberances distributed even along the inner surface of the clamp for affixing the wafer, wherein the square protuberances only hold the edge of the device regions of the wafer. Even though the wafer is slightly off position, the square protuberances are still able to affix the wafer properly. In addition, the lifetime of the clamp of the invention is about 100 hours, which is two times of a conventional clamp, so that the cost is reduced.
REFERENCES:
patent: 5326725 (1994-07-01), Sherstinsky et al.
patent: 5855687 (1999-01-01), Du Bois et al.
patent: 5868847 (1999-02-01), Chen et al.
Ho Jim
Lee Ray
Lin Ming-Hong
Lin Shih-Po
Bueker Richard
Fieler Erin
Mosel Vitelic Inc.
ProMOS Technologies Inc.
Siemens AG
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