Metal treatment – Process of modifying or maintaining internal physical... – Producing or treating layered – bonded – welded – or...
Reexamination Certificate
2011-02-18
2011-10-18
Austin, Aaron (Department: 1784)
Metal treatment
Process of modifying or maintaining internal physical...
Producing or treating layered, bonded, welded, or...
C148S518000, C117S009000
Reexamination Certificate
active
08038810
ABSTRACT:
A method for manufacturing a oriented substrate for forming an epitaxial thin film thereon, having a more excellent orientation than that of a conventional one and a high strength, and a method for manufacturing the same. The clad textured metal substrate includes a metallic layer and a copper layer bonded to at least one face of the above described metallic layer, wherein the above described copper layer has a {100}<001> cube texture in which a deviating angle Δφ of crystal axes satisfies Δφ≦6 degree. The substrate has an intermediate layer on the surface of the copper layer, to form the epitaxial thin film thereon.
REFERENCES:
patent: 2009/0038714 (2009-02-01), Goyal
Varanasi, Chakrapani V., et al. “Biaxially Textured Copper and Copper-Iron Alloy Substrates for Use in YBa2Cu3O7-xCoated Conductors.”Superconductor Science and Technology, ISSN-0953-2048, 2006, vol. 19, p. 85-95.
Yu et al., “LZO Covered Cu-based Substrates”. Journal of Alloys and Compounds, vol. 460, No. 1-2, Jun. 2, 2007, pp. 519-523.
Miyoshi et al. “Development of Textured Substrates With High Strength and Weak Magnetism”, Physica C. vol. 445-448, Oct. 1, 2006, pp. 614-619.
Hoshino Hirofumi
Kashima Naoji
Nagaya Shigeo
Shima Kunihiro
Austin Aaron
Chubu Electric Power Co., Ltd.
Roberts & Roberts, LLP
Tanaka Kikinzoku Kogyo K.K.
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