Clad textured metal substrate for forming epitaxial thin...

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...

Reexamination Certificate

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C428S677000, C428S674000, C428S701000

Reexamination Certificate

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07927715

ABSTRACT:
A clad textured metal substrate for forming the epitaxial thin film thereon, which includes a metallic layer and a copper layer bonded to at least one face of the metallic layer, wherein the copper layer has a {100}<001> cube texture in which a deviating angle Δφ of crystal axes satisfies Δφ≦6 degree. The clad textured metal substrate has an intermediate layer on the surface of the copper layer to form the epitaxial thin film thereon. The intermediate layer preferably includes at least one layer of a material selected from the group consisting of nickel, nickel oxide, zirconium oxide, rare-earth oxide, magnesium oxide, strontium titanate (STO), strontium barium titanate (SBTO), titanium nitride, silver, palladium, gold, iridium, ruthenium, rhodium and platinum.

REFERENCES:
patent: 2009/0038714 (2009-02-01), Goyal
Yu et al., “LZO Covered Cu-based Substrates”, Journal of Alloys and Compounds, vol. 460, No. 1-2, Jun. 2, 2007, pp. 519-523.
Miyoshi et al., “Development of Textured Substrates With High Strength and Weak Magnetism”, Physica C, vol. 445-448, Oct. 1, 2006, pp. 614-619.
Varanasi, Chakrapani V., et al. “Biaxially Textured Copper and Copper-Iron Alloy Substrates for Use in YBa2Cu3O7-x Coated Conductors.”Superconductor Science and Technology, 2006, vol. 19, p. 85-95.

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