Clad molybdenum disks for alloyed diode

Details Clad molybdenum disks for alloyed diode Clad molybdenum disks for alloyed diode

1979-11-30

1982-11-09

James, Andrew J.

357 65, 357 68, H01L 2348, H01L 2946, H01L 2954

Patent

active

043587844

ABSTRACT:
An alloyed diode is formed of a silicon wafer which is sandwiched between two pre-clad molybdenum disks. The upper molybdenum disk is clad on the side facing the silicon wafer with a thin aluminum foil and is clad on its outer surface with a nickel foil. The bottom molybdenum is clad with a solder foil of silver containing small amounts of germanium, copper and arsenic on the surface facing the silicon and is clad with nickel on its opposite surface. The three parts are stacked atop one another and placed in an alloying furnace to form a completed semiconductor wafer with solderable electrodes on opposite sides.

REFERENCES:
patent: 2854612 (1958-09-01), Zaratkiewicz
patent: 3093882 (1963-06-01), Emeis
patent: 3184823 (1965-05-01), Little et al.
patent: 3184824 (1965-05-01), Fairbairn
patent: 3447236 (1969-06-01), Hatcher
patent: 3566209 (1971-02-01), Shaw
patent: 3620692 (1971-11-01), Franklin
patent: 4096510 (1978-06-01), Arai et al.

Affiliated with

Also associated with

Rating

Clad molybdenum disks for alloyed diode does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Clad molybdenum disks for alloyed diode, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Clad molybdenum disks for alloyed diode will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-748299