CISFET Processing including simultaneous doping of silicon compo

Metal treatment – Compositions – Heat treating

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29571, 148187, 357 23, 357 41, 357 59, 357 91, H01L 2978, H01L 2196, B01J 1700, H01L 1114

Patent

active

042126843

ABSTRACT:
A process for forming a CIS (conductor-insulator-semiconductor) integrated circuit having one or more field-effect memory transistors, and one or more polysilicon resistors and/or polysilicon conductors. The polysilicon components are formed to predetermined sizes, as needed, so that the implant used to establish the memory threshold voltage of the transistor also provides the desired polysilicon resistance value(s). The process may be used to simultaneously form both memory and non-memory transistors.

REFERENCES:
patent: 3750268 (1973-08-01), Wang
patent: 3868274 (1975-02-01), Hubar et al.
patent: 3889358 (1975-06-01), Bierhenke
patent: 3897282 (1975-07-01), White
patent: 3996657 (1976-12-01), Simko et al.
patent: 4041522 (1977-08-01), Oguey et al.
patent: 4074301 (1978-02-01), Paivinen et al.
patent: 4075045 (1978-02-01), Rideout
patent: 4080718 (1978-03-01), Richman
patent: 4095251 (1978-06-01), Dennard
patent: 4101921 (1978-07-01), Shimada et al.
patent: 4104784 (1978-08-01), Klein
patent: 4110776 (1978-08-01), Rao et al.
Tsuchimoto et al., "Ion Impl.sup.n . . . Polycrystalline Si", Ion Implantation in Semiconductors, Ed. Namba, Plenum, New York, 1974.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

CISFET Processing including simultaneous doping of silicon compo does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with CISFET Processing including simultaneous doping of silicon compo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and CISFET Processing including simultaneous doping of silicon compo will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-462473

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.