Circular wire-bond pad, package made therewith, and method...

Details Circular wire-bond pad, package made therewith, and method... Circular wire-bond pad, package made therewith, and method...

2007-07-31

2007-07-31

Parker, Kenneth (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257SE25013, C257S685000, C257S686000, C257S723000, C438S108000, C438S109000, C361S760000, C228S180500, C228S004500

Reexamination Certificate

active

10881741

ABSTRACT:
A wire-bonding substrate includes a curvilinear wire-bond pad. The curvilinear wire-bond pad is used in reverse wire bonding to couple a die with the substrate. A curvilinear wire-bond pad is also disclosed that is located directly above the via in the substrate. A wire-bonding substrate includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the wire-bonding substrate. A package is includes a chip stack with a total die-side characteristic dimension, and a total substrate-side characteristic dimension that is smaller than the total die-side characteristic dimension. A computing system includes the curvilinear wire-bond pad.

REFERENCES:
patent: 5804004 (1998-09-01), Tuckerman et al.
patent: 5889324 (1999-03-01), Suzuki
patent: 6181002 (2001-01-01), Juso et al.
patent: 6239496 (2001-05-01), Asada
patent: 6333562 (2001-12-01), Lin
patent: 6340846 (2002-01-01), LoBianco et al.
patent: 6476506 (2002-11-01), O'Connor et al.
patent: 6570249 (2003-05-01), Liao et al.
patent: 6710455 (2004-03-01), Goller et al.
patent: 2003/0047813 (2003-03-01), Goller et al.

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