Circular test pads on scribe street area

Details Circular test pads on scribe street area Circular test pads on scribe street area

2007-08-21

2007-08-21

Graybill, David E. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S114000

Reexamination Certificate

active

10145442

ABSTRACT:
A semiconductor wafer design and process having test pads (36) reducing cracks generated during the wafer saw process from extending into and damaging adjacent die. The present invention provides a plurality of circular test pads (36) in a wafer scribe street (34) such that any cracks generated in the test pad during wafer saw self terminate in the periphery of the circular test pad. By providing a curved test pad periphery, cracks will tend to propagate along the edges of the test pads and self terminate therein. The circular test pads avoid any sharp corners as is conventional in rectangular test pads which tend to facilitate the extension of cracks from corners to extend into the adjacent wafer die (32). The present invention utilizes existing semiconductor fab processing and utilizes new reticle sets to define the curved test pads.

REFERENCES:
patent: 3795973 (1974-03-01), Calhoun
patent: 4751458 (1988-06-01), Elward, Jr.
patent: 4835592 (1989-05-01), Zommer
patent: 5003374 (1991-03-01), Vokoun, III
patent: 5024970 (1991-06-01), Mori
patent: 5059899 (1991-10-01), Farnworth et al.
patent: 5096855 (1992-03-01), Vokoun, III
patent: 5126286 (1992-06-01), Chance
patent: 5206181 (1993-04-01), Gross
patent: 5214657 (1993-05-01), Farnworth et al.
patent: 5334857 (1994-08-01), Mennitt et al.
patent: 5366906 (1994-11-01), Wojnarowski et al.
patent: 5477062 (1995-12-01), Natsume
patent: 5635424 (1997-06-01), Rostoker et al.
patent: 5665655 (1997-09-01), White
patent: 5706178 (1998-01-01), Barrow
patent: 5731222 (1998-03-01), Malloy et al.
patent: 5759910 (1998-06-01), Mangold et al.
patent: 5834829 (1998-11-01), Dinkel et al.
patent: 5981370 (1999-11-01), Rincon et al.
patent: 5986460 (1999-11-01), Kawakami
patent: 6027859 (2000-02-01), Dawson et al.
patent: 6046101 (2000-04-01), Dass et al.
patent: 6121677 (2000-09-01), Song et al.
patent: 6127196 (2000-10-01), Butera et al.
patent: 6133134 (2000-10-01), Mehr
patent: 6166556 (2000-12-01), Wang et al.
patent: 6192289 (2001-02-01), Geffen et al.
patent: 6249114 (2001-06-01), Sakai
patent: 6268568 (2001-07-01), Kim
patent: 6271578 (2001-08-01), Mitwalsky et al.
patent: 6330166 (2001-12-01), Aoyama et al.
patent: 6352940 (2002-03-01), Seshan et al.
patent: 6365443 (2002-04-01), Hagiwara et al.
patent: 6399400 (2002-06-01), Osann et al.
patent: 6525422 (2003-02-01), Ono et al.
patent: 6542377 (2003-04-01), Fisher et al.
patent: 6582085 (2003-06-01), Kosugi
patent: 6768062 (2004-07-01), Morimoto et al.
patent: 2002/0050629 (2002-05-01), Seshan et al.
patent: 2002/0076966 (2002-06-01), Carron et al.
patent: 2003/0094966 (2003-05-01), Fang
patent: 2002373924 (2002-12-01), None

Affiliated with

Also associated with

Rating

Circular test pads on scribe street area does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circular test pads on scribe street area, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circular test pads on scribe street area will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3865613