Circular stripline package incorporating a MMIC low noise amplif

Details Circular stripline package incorporating a MMIC low noise amplif Circular stripline package incorporating a MMIC low noise amplif

1997-03-18

1999-11-16

Mullins, James B.

Amplifiers

With semiconductor amplifying device

Including distributed parameter-type coupling

330307, H03F 319

Patent

active

059865059

ABSTRACT:
A circular low noise amplifier package having an X-band MMIC low noise amplifier disposed therein, that may be preferably used with an existing stripline receiver board employed in a missile. The package has three input/output ports symmetrically located around the package, including DC bias, RF input, and RF output ports. The package mounts directly into the stripline receiver board as a drop-in replacement for an isolator used in the existing stripline receiver board. The circular low noise amplifier package comprises a top cover, an upper RF gasket, a package lid, a hermetic low noise amplifier module containing a low noise amplifier chip, a lower RF gasket, and a bottom cover. The amplifier module has feedthrough pins that extend through the outer wall thereof and couple to the low noise amplifier chip. The top and bottom covers are used to secure the amplifier package to the stripline receiver board. The upper and lower RF gaskets aid in improving an RF ground. The package lid is seam sealed to the amplifier module to hermetically seal the entire package.

REFERENCES:
patent: 3651434 (1972-03-01), McGeough et al.

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