Circular magnetron sputtering device

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

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Details

20429809, 20429824, 20429835, 20429837, C23C 1434, C23C 1456

Patent

active

049275151

ABSTRACT:
A circular magnetron sputtering device has a cathode structure including an annular magnet and an annular body of target material positioned coaxially with and inside of said annular magnet, and an anode structure spaced from and in juxtaposition with openings of said annular magnet. An elongated substrate is passed through the anode structure and through said cathode structure where sputtered target material is deposited on said elongated substrate.

REFERENCES:
patent: 3728246 (1973-04-01), Barkhudarov et al.
patent: 3884793 (1975-05-01), Penfold et al.
patent: 3939052 (1976-02-01), Riley
patent: 4249925 (1981-02-01), Kawashima et al.
patent: 4434042 (1984-02-01), Keith
patent: 4530750 (1985-06-01), Aisenberg et al.
patent: 4775075 (1973-11-01), Keck et al.

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