Circuitized substrates utilizing smooth-sided conductive...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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C174S260000

Reexamination Certificate

active

07838776

ABSTRACT:
A circuitized substrate in which two conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to an interim dielectric layer. Each of the two foil surfaces which physically bond to the dielectric are smooth (e.g., preferably by chemical processing) and include a thin, organic layer thereon, while the outer surfaces of both foils are also smooth (e.g., preferably also using a chemical processing step). One of these resulting conductive layers may function as a ground or voltage plane while the other may function as a signal plane with a plurality of individual signal lines as part thereof. An electrical assembly and an information handling system utilizing such a circuitized substrate are also provided.

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patent: 5545466 (1996-08-01), Saida et al.
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patent: 6291081 (2001-09-01), Kurabe et al.
patent: 6322904 (2001-11-01), Dobashi et al.
patent: 6475638 (2002-11-01), Mitsuhashi et al.
patent: 6808825 (2004-10-01), Nagai
patent: 5-160208 (1993-06-01), None

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