Circuitized substrate with sintered paste connections,...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C174S257000, C174S258000, C361S792000

Reexamination Certificate

active

07342183

ABSTRACT:
A circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder component and at least one metallic component. The flakes of the metallic component are sintered to form a conductive path through the dielectric when the dielectric is used as a layer in the substrate.

REFERENCES:
patent: 5026624 (1991-06-01), Day et al.
patent: 5300402 (1994-04-01), Card, Jr. et al.
patent: 5891283 (1999-04-01), Tani et al.
patent: 6120708 (2000-09-01), Ohshita et al.
patent: 6300576 (2001-10-01), Nakamura et al.
patent: 6641898 (2003-11-01), Yazaki et al.
patent: 6762496 (2004-07-01), Yamamoto et al.
patent: 6809269 (2004-10-01), Fuller, Jr. et al.
patent: 6815837 (2004-11-01), Alcoe
patent: 6828514 (2004-12-01), Chan et al.
patent: 2002/0050586 (2002-05-01), Oshita et al.
patent: 2004/0118598 (2004-06-01), Fuller et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Circuitized substrate with sintered paste connections,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuitized substrate with sintered paste connections,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuitized substrate with sintered paste connections,... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3979829

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.