Circuitized substrate with sintered paste connections,...

Details Circuitized substrate with sintered paste connections,... Circuitized substrate with sintered paste connections,...

2005-07-11

2008-03-11

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S257000, C174S258000, C361S792000

Reexamination Certificate

active

07342183

ABSTRACT:
A circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder component and at least one metallic component. The flakes of the metallic component are sintered to form a conductive path through the dielectric when the dielectric is used as a layer in the substrate.

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