Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-04-24
2007-04-24
Reichard, Dean A. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S794000, C361S818000, C361S767000, C361S777000, C361S778000, C361S795000, C174S252000
Reexamination Certificate
active
10790747
ABSTRACT:
A circuitized substrate in which at least one signal line used therein is shielded by a pair of opposingly positioned ground lines which in turn are electrically coupled to a ground plane located beneath the signal and ground lines and separated therefrom by a common interim dielectric layer. An electrical assembly including the circuitized substrate as part thereof and a method of making the circuitized substrate are also included. The substrate may form part of a larger structure such as a PCB, chip carrier or the like.
REFERENCES:
patent: 5031073 (1991-07-01), Chang
patent: 5196230 (1993-03-01), Okonogi et al.
patent: 5455393 (1995-10-01), Ohshima et al.
patent: 5649160 (1997-07-01), Corry et al.
patent: 5662816 (1997-09-01), Andry
patent: 5684340 (1997-11-01), Soler et al.
patent: 6010769 (2000-01-01), Sasaoka et al.
patent: 6020614 (2000-02-01), Worley
patent: 6040524 (2000-03-01), Kobayashi et al.
patent: 6236572 (2001-05-01), Teshome et al.
patent: 6239485 (2001-05-01), Peters et al.
patent: 6353189 (2002-03-01), Shimada et al.
patent: 6429752 (2002-08-01), Harju et al.
patent: 6429757 (2002-08-01), Karlsson et al.
patent: 6522214 (2003-02-01), Harju et al.
patent: 6529229 (2003-03-01), Nagumo
patent: 6657130 (2003-12-01), Van Dyke et al.
patent: 6992255 (2006-01-01), Oprysko et al.
patent: 2002/0100613 (2002-08-01), Anstrom et al.
patent: 2002/0108780 (2002-08-01), Blackwell et al.
patent: 2002/0148637 (2002-10-01), Anstrom et al.
patent: 2004/0009666 (2004-01-01), Ishizuki et al.
Lauffer John M.
Markovich Voya
Seastrand Corey
Thomas David L.
Endicott Interconnect Technologies, Inc.
Fraley Lawrence R.
Hinman, Howard & Kattell LLP
Nguyen Hoa C.
Reichard Dean A.
LandOfFree
Circuitized substrate with signal wire shielding, electrical... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Circuitized substrate with signal wire shielding, electrical..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuitized substrate with signal wire shielding, electrical... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3745790