Circuitized substrate with same surface conductors of different

Details Circuitized substrate with same surface conductors of different Circuitized substrate with same surface conductors of different

1997-02-04

1998-10-06

Lam, Cathy F.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428137, 428901, 174257, B32B 900

Patent

active

058174052

ABSTRACT:
A process for making a circuitized substrate is defined wherein the substrate is treated with two different, e.g., additive and subtractive, metallization processes. The process is thus able to effectively produce substrates including conductive features, e. g., high density circuit lines and chip heat-sinking pads, of two different degrees of resolution in a cost effective and expeditious manner. The resulting product is also defined.

REFERENCES:
patent: 4383363 (1983-05-01), Hayakawa et al.
patent: 4705592 (1987-11-01), Bahrle et al.
patent: 5079065 (1992-01-01), Masakazu et al.
patent: 5252195 (1993-10-01), Kobayashi et al.
patent: 5277787 (1994-01-01), Otani et al.
patent: 5314788 (1994-05-01), Suzuki et al.

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