Circuitized substrate with material containment means and method

Details Circuitized substrate with material containment means and method Circuitized substrate with material containment means and method

1996-02-20

1998-03-24

Kincaid, Kristine L.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174 522, 174 524, 174252, H05K 109

Patent

active

057315477

ABSTRACT:
A circuitized substrate having conductive circuitry thereon and a barrier located adjacent at least portions of the circuitry to serve as an effective constraint for liquid material (e.g., encapsulant) applied to cover and protect the circuitry. The barrier can be formed concurrently with circuitry formation and formed of materials (e.g., copper, nickel, gold) similar to those used for the circuitry. The barrier is of two-part construction and of a particular shape wherein one part affords a greater surface tension than the other such that the material may actually lie on one part while being prevented from engagement with the other. Providing such dual (or "progressive") surface tensions successfully constrains the liquid material at least until solidification thereof occurs.

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patent: 4814943 (1989-03-01), Okuaki
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patent: 5284548 (1994-02-01), Carey et al.
patent: 5336931 (1994-08-01), Juskey et al.
patent: 5382759 (1995-01-01), Kei Lau et al.

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