Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2006-05-16
2006-05-16
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
C257S779000, C174S261000, C361S743000, C361S767000, C361S772000, C361S808000
Reexamination Certificate
active
07045902
ABSTRACT:
A circuitized substrate has contact pads for mounting a Surface Mount Device (SMD). First and second contact pads are located on a surface of the substrate corresponding to a first terminal and a second terminal of the SMD. The first and the second contact pads have a plurality of expanded portion or diminished portions to form bead receptacles at the facing corners thereof. When solder paste is reflowed to electrically connect the SMD, solder beads formed from the solder paste can be fixed on the bead receptacles. Therefore, there is no free solder bead on the substrate causing short circuit for semiconductor packages.
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Advanced Semiconductor Engineering Inc.
Nelms David
Taylor Earl
Troxell Law Office PLLC
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