Circuitized substrate assembly and method of making same

Details Circuitized substrate assembly and method of making same Circuitized substrate assembly and method of making same

2006-07-04

2006-07-04

Patel, Ishwar (I. B.) (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S255000

Reexamination Certificate

active

07071423

ABSTRACT:
A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only one of which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.

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IBM TDB, “Automatic Method For Registration And Stacking of Laminates”, by Hollis.
IBM TDB, “Multilayer Subsurface Circuit Board Constructions”, by Mace.

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