Circuitized substrate and method of making same

Details Circuitized substrate and method of making same Circuitized substrate and method of making same

2006-06-20

2006-06-20

Rossi, Jessica (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S151000, C427S096100, C427S098400, C427S098500, C427S099100, C427S099500, C427S123000, C427S304000, C427S305000, C427S443100

Reexamination Certificate

active

07063762

ABSTRACT:
A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to securely adhere a conductive layer thereto which is deposited by plating. The resulting product is thus able to provide extremely narrow conductive circuitry for subsequent connections, e.g., to a semiconductor chip. Electroless plating is the preferred plating method with the dielectric immersed in a solution of conductive monomers, e.g., pyrrole monomer, the solution also possibly containing a seed material such as palladium-tin.

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