Circuitized substrate

Details Circuitized substrate Circuitized substrate

2006-07-18

2006-07-18

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S762000, C257S760000

Reexamination Certificate

active

07078816

ABSTRACT:
A circuitized substrate comprising a first layer comprised of a dielectric material including a resin material including a predetermined quantity of particles therein and not including continuous fibers, semi-continuous fibers or the like as part thereof, and at least one circuitized layer positioned on the dielectric first layer. An electrical assembly and a method of making the substrate is also provided, as is a circuitized structure including the circuitized substrate in combination with other circuitized substrates having lesser dense thru-hole patterns. An information handling system incorporating the circuitized substrate of the invention as part thereof is also provided.

REFERENCES:
patent: 3953566 (1976-04-01), Gore
patent: 3962653 (1976-06-01), Basset
patent: 4187390 (1980-02-01), Gore
patent: 4482516 (1984-11-01), Bowman et al.
patent: 4579772 (1986-04-01), Bhatt et al.
patent: 4642160 (1987-02-01), Burgess
patent: 4675789 (1987-06-01), Kuwabara et al.
patent: 4713137 (1987-12-01), Sexton
patent: 4783345 (1988-11-01), Kleeberg et al.
patent: 4864722 (1989-09-01), Lazzarini et al.
patent: 5129142 (1992-07-01), Bindra et al.
patent: 5229550 (1993-07-01), Bindra et al.
patent: 5246817 (1993-09-01), Shipley
patent: 5368921 (1994-11-01), Ishii et al.
patent: 5376453 (1994-12-01), von Gentzkow et al.
patent: 5418689 (1995-05-01), Alpaugh et al.
patent: 5483101 (1996-01-01), Shimoto et al.
patent: 5565267 (1996-10-01), Capote et al.
patent: 5648171 (1997-07-01), von Gentzkow et al.
patent: 5652055 (1997-07-01), King et al.
patent: 5670262 (1997-09-01), Dalman
patent: 5677045 (1997-10-01), Nagai et al.
patent: 5685070 (1997-11-01), Alpaugh et al.
patent: 5726863 (1998-03-01), Nakayama et al.
patent: 5814405 (1998-09-01), Branca et al.
patent: 5822856 (1998-10-01), Bhatt et al.
patent: 5981880 (1999-11-01), Appelt et al.
patent: 6018196 (2000-01-01), Noddin
patent: 6042685 (2000-03-01), Shinada et al.
patent: 6119338 (2000-09-01), Wang et al.
patent: 6143401 (2000-11-01), Fischer
patent: 6207595 (2001-03-01), Appelt et al.
patent: 6212769 (2001-04-01), Boyko et al.
patent: 6248959 (2001-06-01), Sylvester
patent: 6291779 (2001-09-01), Lubert et al.
patent: 6323436 (2001-11-01), Hedrick et al.
patent: 6378201 (2002-04-01), Tsukada et al.
patent: 6405431 (2002-06-01), Shin et al.
patent: 6506979 (2003-01-01), Shelnut et al.
patent: 6541589 (2003-04-01), Baillie
patent: 6586687 (2003-07-01), Lee et al.
patent: 2002/0150673 (2002-10-01), Thorn et al.
patent: 2002/0170827 (2002-11-01), Furuya
patent: 2002/0172019 (2002-11-01), Suzuki et al.
patent: 2002/0190378 (2002-12-01), Hus et al.
patent: 2003/0022103 (2003-01-01), Japp et al.
patent: 2004/0256731 (2004-12-01), Mao et al.
patent: 56049271 (1981-05-01), None
patent: 7086710 (1995-03-01), None
patent: 7097466 (1995-04-01), None
patent: 8092394 (1996-04-01), None
patent: 2001015912 (2001-01-01), None
patent: 2002223070 (2002-08-01), None

Affiliated with

Also associated with

Rating

Circuitized substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuitized substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuitized substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3588017