Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1995-05-22
1999-08-03
Lorin, Francis J.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
29830, H05K 330
Patent
active
059320478
ABSTRACT:
A circuitized structure including a flexible circuit with at least one layer of dielectric having a plurality of electrically conductive members (e.g., copper pads) thereon. An elastomeric member including a plurality of upstanding portions each having a respective metallic pad member thereon is utilized, this elastomeric-pad structure being bonded to the flexible circuit at locations relative to respective ones of the conductive members so as to assure substantially independent force exertion thereon, e.g., when the flexible circuit is electrically coupled to a separate, circuitized substrate such as a printed circuit board. A method for making an elastomeric support member for use in such a circuitized substrate is also provided.
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39th Electronic Components Conference, May 1989, "Use of Anisotropically Conductive Elastomers in High Density Separable Connectors", W. R. Lambert et al., pp. 99-106.
Brodsky William Louis
Herard James Daniel
Macek Thomas George
Sharp Timothy Lee
Shovlowsky George Joseph
Fraley Lawrence R.
International Business Machines - Corporation
Lorin Francis J.
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