Circuitization of polymeric circuit boards with galvanic removal

Details Circuitization of polymeric circuit boards with galvanic removal Circuitization of polymeric circuit boards with galvanic removal

1991-02-01

1992-06-30

Tufariello, T. M.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

20412965, 20412975, C25D 502, C25F 302

Patent

active

051260166

ABSTRACT:
Disclosed is a method of fabricating a microelectronic package, especially a microelectronic package having copper circuitization on a dielectric substrate. The method includes the steps of depositing a chromium adhesion layer on the dielectric substrate, depositing a copper seed layer on the chromium adhesion layer, depositing photoresist on the copper seed layer, imaging and developing the photoresist, and forming a pattern of copper circuitization on the selected portions of the send copper layer. The chromium adhesion layer material is removed from the dielectric substrate by contacting the chromium adhesion layer with aqueous sulfuric acid electrolyte, while maintaining the chromium adhesion layer electrolytically in series with a counterelectrode, and maintaining the chromium adhesion layer anodic with respect to the counterelectrode. The chromium adhesion layer material is oxidized to soluble Cr.sup.+3, while substantially avoiding formation of Cr.sup.+6.

REFERENCES:
patent: 2840521 (1958-06-01), Wasserman
"Polymers & Polymer-Based Composites for Electronic Applications" G. P. Schmitt et al., pp. 334-371.
"Printed Circuit-Board Packaging", D. P. Seraphim et al.; pp. 853-921.

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