Circuit unit for timepiece and process for fabricating the same

Horology: time measuring systems or devices – Chronological – With significant casing or mounting support structure

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174 522, 29827, G04C 2302, H02G 1308

Patent

active

047962399

ABSTRACT:
A circuit unit including a plurality of lead frames which are made of a metal sheet and one of which is used for die-bonding an integrated circuit. The die-bonding lead member is formed to have at least a generally H-shaped portion constructed of a pair of parallel side portions and a connecting portion for connecting the two side portions for die-bonding the integrated circuit thereto. The remaining lead members are separated from said die-bonding one and have individual end portions positioned in the vicinity of the integrated circuit and connected electrically therewith by means of bonding wires. The die-bonding lead member and the remaining lead members are integrated either with a potting resin for protection the integrated circuit or with the potting resin and/or an insulating plate backing the potting resin. The aforementioned two side portions are fixed on a holding member. Also disclosed is a process for fabricating the aforementioned circuit unit.

REFERENCES:
patent: 3611061 (1971-10-01), Segerson
patent: 3885304 (1975-05-01), Kaiser et al.
patent: 3908075 (1975-09-01), Jackson et al.
patent: 4086696 (1978-05-01), Ikuta
patent: 4164843 (1979-08-01), Fujimori
patent: 4186551 (1980-02-01), Nakayama
patent: 4241436 (1980-12-01), Bolzt et al.
patent: 4546697 (1981-01-01), Smith

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