Circuit terminations having improved electrical and structural i

Details Circuit terminations having improved electrical and structural i Circuit terminations having improved electrical and structural i

1988-10-03

1990-02-13

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

29397, 361414, 174259, 174265, 174267, H05K 100, H05K 300

Patent

active

049008781

ABSTRACT:
Terminations (10, 40, 70, 90) for flexible printed circuitry comprises thermosetting epoxy or polyimide prepreg sheets (36, 56, 64, 88, 102) in the rigid portion, instead of thermoplastic acrylic adhesive, partial coverlays (20, 50, 84, 94) instead of full coverlays and, as desired, rigidized members of epoxy or polyimide glass (16, 52, 54, 86) or prepreg internally as well as externally of the terminations. Anchor pads 34 secured to plated-through holes (38) minimize z-axis expansion of the terminations.

REFERENCES:
patent: 3439109 (1969-04-01), Birt et al.
patent: 3471348 (1969-10-01), Shaheen et al.
patent: 3516156 (1970-06-01), Steranko
patent: 3740678 (1973-06-01), Hill
patent: 3923359 (1975-12-01), Newsam
patent: 4150421 (1979-04-01), Nishihara et al.
patent: 4191800 (1980-03-01), Holtzman
patent: 4464704 (1984-08-01), Huie et al.
patent: 4482937 (1984-11-01), Berg
patent: 4533978 (1985-08-01), Walter
patent: 4594473 (1986-06-01), Inoue et al.
patent: 4769270 (1988-09-01), Nagamatsu et al.
patent: 4791239 (1988-12-01), Shirahata et al.
patent: 4804575 (1989-02-01), Kohm
patent: 4812792 (1989-03-01), Leibowitz

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