Circuit system, a composite metal material for use therein, and

Details Circuit system, a composite metal material for use therein, and Circuit system, a composite metal material for use therein, and

1988-03-10

1990-01-16

Dean, R.

Stock material or miscellaneous articles

All metal or with adjacent metals

Laterally noncoextensive components

C22C 900

Patent

active

048942936

ABSTRACT:
A circuit system has a semiconductor device mounted on a substrate which includes a composite metal material comprising a plurality of discrete elements of ferrous metal material such as an alloy of 36 percent nickel and the balance iron having a relatively low coefficient of thermal expansion, the discrete elements being copper-coated by electroless copper plating or the like and being pressed together and heated for sintering or diffusion-bonding the copper coatings together to form a continuous copper matrix having the discrete elements secured in dispersed relation therein for providing the composite metal material with a coefficient of thermal expansion relatively much lower than that of the copper material, the heating of the coated particles for diffusion bonding thereof being regulated for forming the continuous copper matrix while leaving the copper material of the matrix substantially free of nickel, ferrous or other constituents diffused therein from the discrete elements for providing the composite material with improved thermal conductivity.

REFERENCES:
patent: 3097329 (1963-07-01), Siemens
patent: 3220107 (1965-11-01), Clark
patent: 3399332 (1968-08-01), Savolainen
patent: 4158719 (1979-06-01), Frantz
patent: 4283464 (1981-08-01), Hascoe
patent: 4472672 (1984-09-01), Spinelli et al.
patent: 4529836 (1985-07-01), Powers et al.
patent: 4569692 (1986-02-01), Butt
patent: 4680618 (1987-07-01), Kuroda et al.

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