Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2006-12-05
2006-12-05
Schillinger, Laura M. (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S107000, C257S705000, C257S013000
Reexamination Certificate
active
07144757
ABSTRACT:
This invention relates to a vertically integratable circuit and a method for producing same.Unlike known methods for producing vertical electric connections, the present method uses process steps in the production of the vertically integratable circuit itself to permit vertical integration. This simplifies the sequence of production for vertically integratable circuits and thus the three-dimensional integrated circuit as a whole, thereby optimizing plant running times since process steps are saved. Because finished substrates are no longer the starting point for producing the vertical electric connections, an improved yield is moreover obtained since no process steps which could in particular change the already produced active circuit elements, such as steps with high process temperatures, are necessary any longer after production of the circuit elements.
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Bacon & Thomas PLLC
Giesecke & Devrient GmbH
Schillinger Laura M.
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