Circuit substrate with resistance layer and process for producin

Stock material or miscellaneous articles – Composite – Of metal

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428639, 428901, 252512, 252513, 252514, B32B 1504

Patent

active

045321868

ABSTRACT:
A circuit substrate with a resistance layer and a process for producing the same are disclosed. The circuit substrate comprises an electrically insulating layer, a resistance layer bonded to at least one surface of the electrically insulating layer and a highly conductive material layer bonded to the resistance layer, and has a high sheet resistance value. The resistance layer comprises an alloy containing tin, nickel, sulfur and optionally specific elements.

REFERENCES:
patent: 4311768 (1982-01-01), Berdan et al.
patent: 4350743 (1982-09-01), Lazzari
patent: 4360564 (1982-11-01), Philipp

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Circuit substrate with resistance layer and process for producin does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit substrate with resistance layer and process for producin, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit substrate with resistance layer and process for producin will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2372865

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.