Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-02-29
1998-09-15
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361748, 361761, 257659, 257777, H05K 900
Patent
active
058088784
ABSTRACT:
A circuit substrate which is formed by fixing a wiring pattern on an insulated substrate has a shielding member for absorbing or reflecting radio waves formed on a first electronic component electrically connected. A shielding layer for absorbing or reflecting radio waves is formed on the circuit substrate. And, a second electronic component is disposed between the first electronic component and the shielding layer.
REFERENCES:
patent: 4717990 (1988-01-01), Tugcu
patent: 5294826 (1994-03-01), Marcantonio et al.
patent: 5557508 (1996-09-01), Sato et al.
"High-Performance Processor", IBM Technical Disclosure Bulletin, vol. 31, No. 10, Mar. 1989, pp. 229-231.
"Double Layer Recessed Hybrid Flip Chip on Board", Motorola Technical Developments, vol. 11, Oct. 1990, pp. 158-159.
EPO Search Report, Mar. 19, 1997.
Maekawa Youko
Saito Yasuhito
Yoshioka Shimpei
Gandhi Jayprakash N.
Kabushiki Kaisha Toshiba
Picard Leo P.
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